NVIDIA and TSMC celebrate first Blackwell wafer produced in the US
- NVIDIA and TSMC mark Blackwell wafer production milestone.
- Wafer production supports US supply chain and AI innovation.
- Event highlights collaboration between NVIDIA and TSMC.
NVIDIA and TSMC have celebrated the first NVIDIA Blackwell wafer produced in the United States. The event took place at TSMC’s semiconductor manufacturing facility in Phoenix on October 17.
NVIDIA founder and CEO Jensen Huang and TSMC vice president of operations Y.L. Wang signed the Blackwell wafer during the celebration. Huang stated, “This is a historic moment for several reasons.
It’s the very first time in recent American history that the single most important chip is being manufactured here in the United States by the most advanced fab, by TSMC, here in the United States.”
Ray Chuang, CEO of TSMC Arizona, said: “To go from arriving in Arizona to delivering the first U.S.-made NVIDIA Blackwell chip in just a few short years represents the very best of TSMC.”
The wafer will undergo various processes before becoming the high-performance AI chip based on the NVIDIA Blackwell architecture.
The production at TSMC Arizona will include advanced technologies such as two-, three-, and four-nanometer chips, essential for AI and high-performance computing applications.
NVIDIA plans to utilise its AI and robotics technologies to design and operate new U.S. manufacturing facilities.
NVIDIA is a global leader in AI computing, providing solutions that accelerate innovation for enterprises, government organisations, researchers, and startups.
