Hyundai Mobis and Qualcomm team up on software-defined vehicles and ADAS

Hyundai Mobis and Qualcomm Technologies have signed a memorandum of understanding at CES 2026 to jointly develop next-generation software-defined vehicle platforms and advanced driver assistance systems.

The agreement was signed at the Hyundai Mobis booth in Las Vegas and attended by Jung Soo-Kyung, executive vice president and head of the Automotive Electronics Business Unit at Hyundai Mobis, and Nakul Duggal, executive vice president and general manager of Automotive, Industrial and Embedded Internet of Things, and Robotics at Qualcomm Technologies, the companies said in a statement.

Under the partnership, the two groups will co-develop integrated automotive solutions aimed initially at emerging markets, while also pursuing broader global supply opportunities. The collaboration combines Hyundai Mobis’s strengths in system integration, sensor fusion and perception with Qualcomm Technologies’ system-on-chip capabilities.

The first phase of work will focus on advanced driving and parking solutions built on Qualcomm’s Snapdragon Ride Flex system-on-chip. These systems are being targeted at fast-growing automotive markets such as India, where demand for scalable and cost-efficient driver assistance technology is increasing as vehicle volumes rise and safety standards tighten.

Beyond near-term driver assistance features, the companies said they will also work together on future software-defined vehicle applications. This includes the development of next-generation integrated solutions that pair Hyundai Mobis’s standardised software platform with Qualcomm’s Snapdragon automotive technologies. The aim is to improve overall system performance, efficiency and stability as vehicles become more software-centric and increasingly reliant on over-the-air updates and centralised computing architectures.

Hyundai Mobis said the partnership aligns with its broader strategy to expand its role in software-defined vehicles and intelligent mobility systems, moving beyond traditional components towards higher-value electronics and software.

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Alongside the announcement, Hyundai Mobis said it hosted a private exhibition booth at CES 2026 for invited global clients. The showcase was designed to expand its order pipeline across areas including robotics, software-defined vehicle solutions and semiconductors. According to the company, more than 200 representatives from major customers in North America and Europe visited the booth during the four-day event.

The agreement reflects continued momentum at CES around software-defined vehicles, as automakers and suppliers look to standardise platforms, shorten development cycles and adapt more quickly to regional market needs through closer collaboration between hardware and software providers.

The Recap

• Hyundai Mobis and Qualcomm signed SDV and ADAS MOU.
• Co-development begins with Snapdragon Ride Flex system-on-chip SoC.
• Projects will target emerging markets such as India.